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Monocure3D HeatResist

Monocure3D · Photopolymer resin for LCD/MSLA

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Overview

A rigid high-temperature engineering resin intended for parts and mould tooling that must hold their shape at up to about 150 °C.

Summarised from the Monocure3D product page.

Features

  • Heat resistance up to 150 °C
  • High rigidity and dimensional stability
  • Low shrinkage
  • Compatible with MSLA and DLP printers
  • CustomMix additive compatible
Material type
Engineering
Brand family
Monocure3D
Polymer
Photopolymer
Processing technology
LCD/MSLA
Material form
Resin
Manufacturer
Monocure3D
Reinforcements
None

Characteristics

  • High tempHeat deflection temperature of 100 °C or more — keeps its shape in hot environments.

Applications

Based on this material's datasheet values. Every part is different — ask an engineer to confirm it suits yours.

Thermal

150°C ASTM D648

Mechanical

1700MPa ASTM D638
58MPa ASTM D638
5.0% ASTM D638
86D ASTM D2240

Versus other Photopolymer

See where it ranks against the 217 other Photopolymer materials we stock.

    Typical values from each manufacturer's datasheet. Test methods can differ between brands, so treat small gaps as a tie.

    Downloads

    • Technical data sheet (TDS)Monocure3D-heatresist-resin.pdf Download
    • Quick3D summaryThis page as a printable PDF

    Values from the Monocure3D technical data sheet and product page. Last updated . Typical values, not guaranteed minimums — see the disclaimer below.