Quick3D 3DXTECH 3DXSTAT ESD-PC
3DXSTAT · PC filament for FFF
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Overview
Static-dissipative polycarbonate filament loaded with carbon nanotubes, targeting 10^4 to 10^9 ohm surface resistance. Combines a 147C Tg and impact resistance with ESD protection for sensitive applications.
Summarised from the 3DXTECH product page.
Features
- Material type
- Engineering
- Brand family
- 3DXSTAT
- Polymer
- PC
- Processing technology
- FFF
- Material form
- Filament
- Manufacturer
- 3DXTECH
- Reinforcements
- None
Characteristics
- High tempHeat deflection temperature of 100 °C or more — keeps its shape in hot environments.
- ESD-safeStatic-dissipative (surface resistivity 10⁹ Ω/sq or lower) — safe around sensitive electronics.
Applications
Based on this material's datasheet values. Every part is different — ask an engineer to confirm it suits yours.
Physical
- 1.24g/cm³ ISO 1183
- 10⁷ - 10⁹Ω/sq ASTM D257
Thermal
- 143°C DSC
- 135°C ISO 75, 0.45 MPa
Mechanical
- 2300MPa ISO 527
- 68MPa ISO 527
- 6% ISO 527
- 2310MPa ISO 178
- 95MPa ISO 178
Versus other PC
See where it ranks against the 13 other PC materials we stock.
Typical values from each manufacturer's datasheet. Test methods can differ between brands, so treat small gaps as a tie.
Downloads
- Technical data sheet (TDS)3DXSTAT_ESD_PC_v3_TDS.pdf Download
- Quick3D summaryThis page as a printable PDF
Values from the 3DXTECH technical data sheet and product page. Last updated . Typical values, not guaranteed minimums — see the disclaimer below.