Quick3D Ultracur3D EPD 2006
Ultracur3D · Photopolymer resin for DLP/SLA
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Overview
Black rigid daylight-curing resin developed with Photocentric.
Features
- Material type
- Standard
- Brand family
- Ultracur3D
- Polymer
- Photopolymer
- Processing technology
- DLP/SLA
- Material form
- Resin
- Manufacturer
- Forward AM
- Reinforcements
- None
Applications
Based on this material's datasheet values. Every part is different — ask an engineer to confirm it suits yours.
Physical
- 1.2g/cm³ ASTM D792
- HB UL 94 (1.5 mm)
Thermal
- 61°C ASTM D648, 1.82 MPa
Mechanical
- 2370MPa ASTM D638
- 50MPa ASTM D638
- 10.3% ASTM D638
- 2210MPa ASTM D790
- 90MPa ASTM D790
- 0.7kJ/m² ISO 179-1
- 80D ASTM D2240
Versus other Photopolymer
See where it ranks against the 217 other Photopolymer materials we stock.
Typical values from each manufacturer's datasheet. Test methods can differ between brands, so treat small gaps as a tie.
Downloads
- Technical data sheet (TDS)TDS_Ultracur3D_EPD-2006.pdf Download
- Quick3D summaryThis page as a printable PDF
Values from the Forward AM technical data sheet. Last updated . Typical values, not guaranteed minimums — see the disclaimer below.